| 摘要 |
A power semiconductor module is provided to improve electromagnetic compatibility by forming an IC conductive track and a control IC element as well as a first conductive track on an inner part of a base substrate. A power semiconductor module includes a housing(18), an electrically insulating substrate(14), and a printed circuit board(16). A first conductive track(22) comes in contact with an inner part(20) of the electrically insulating substrate facing the printed circuit board. A power semiconductor element(28) operated by a control IC element(34) comes in contact with the first conductive track. A second conductive track(40) is formed on an inner part(38) of the printed circuit board facing the electrically insulating substrate. An elastic connective member(42) comes in contact with the housing between the first and second conductive tracks under the predetermined pressure. An IC conductive track(32) and the control IC element are formed on an inner part of the electrically insulating substrate. |
