| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor integrated circuit element favorable for securing a deformation suppressing effect with respect to a multilayer circuit wiring board while deconcentrating stress, and to provide a semiconductor device. SOLUTION: A stiffener 20 is formed in a shape of a rectangular plate having four corners 50. The stiffener 20 has a rectangular opening 52 capable of storing the semiconductor integrated circuit element 30, and four sides which constitute the opening 52 are formed in parallel with four sides of the stiffener 20. A slit 56 is formed between each corner 54 of the opening 52 and a corresponding corner 50 of the stiffener 20. One end of the slit 56 in the extended direction is opened to the opening 52, and the other end is located near the corresponding corner 50 of the stiffener 20. The width W of the slit 56 in a direction perpendicular to the extended direction of the slits 56 is smaller than the length L1 in the extended direction of the slit 56. COPYRIGHT: (C)2008,JPO&INPIT
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