| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC component with high directivity which can perform radio communication with another IC component. <P>SOLUTION: On a package substrate 100, a first conductor pattern 110 (comprising partial patterns 111 and 112) fed from high frequency input and output terminals 211 and 212 of an IC chip 200 through a metal wire 511 to function as a radiator and a second conductor pattern 120, parallel to the first conductor pattern 110, functioning as a reflector are provided. <P>COPYRIGHT: (C)2008,JPO&INPIT |
