| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus capable of achieving improvement of mounting accuracy compared to a conventional apparatus, even if a mounting cycle time is shortened. <P>SOLUTION: Since a mounting head 6 is separated into a separation head 36 for holding a component 1, and a load driver 13B for pressing the component 1 onto a mounting target work 5 via the separation head 36; only the separation head 36 among the separation head 36 and the load driver 13B can be moved between a component receiving position S2 and a mounting executing position S3. Thus, the component 1 is mounted on the mounting target work 5. Since the separation head 36 can be reduced in weight compared to the entire weight of a conventional mounting head; it has less influence of inertia, and the improvement of mounting accuracy can be realized compared to the conventional mounting head even if the mounting cycle time is shortened. <P>COPYRIGHT: (C)2008,JPO&INPIT |
