| 发明名称 |
HERMETICALLY SEALED PACKAGE AND METHOD OF MAKING SAME |
| 摘要 |
A method and apparatus for forming a hermetic seal between two substrates (101, 201) includes providing an electromagnetic absorbent sealing material (102) perimetrically about a surface of one of the substrates. Furthermore, the illustrative method includes heating the sealing material. In addition, a package (200) having a hermtic seal and apparati for disposing a sealing material are described. |
| 申请公布号 |
WO2006044383(A3) |
申请公布日期 |
2007.11.15 |
| 申请号 |
WO2005US36527 |
申请日期 |
2005.10.11 |
| 申请人 |
CORNING INCORPORATED;HAWTOF, DANIEL W;REDDY, KAMJULA P;STONE, III, JOHN |
发明人 |
HAWTOF, DANIEL W;REDDY, KAMJULA P;STONE, III, JOHN |
| 分类号 |
H01L21/00;C03C3/091;C03C3/093;C03C3/108;C03C8/04;C03C8/10;C03C8/24;C03C27/00;C03C27/06;C03C27/12;H01L21/30;H01L21/46;H01L21/48;H01L51/00;H01L51/52;H05B33/04 |
主分类号 |
H01L21/00 |
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