Leitende Paste und Verfahren zum Herstellen eines keramischen Substrates welches diese Paste verwendet

摘要

A conductive paste (3) for forming via-holes (2) in a ceramic substrate (1), which paste contains 80-94 wt.% spherical or granular conductive metal powder having a particle size of 0.1-50 mu m, 1-10 wt.% resin powder which swells in a solvent contained in the conductive paste and has a particle size of 0.1-40 mu m, and 5-19 wt.% an organic vehicle. The paste hardly generates cracks during firing to thereby attain excellent reliability in electric conduction and which can provide a via-hole having excellent solderability and platability. A method for producing a ceramic substrate making use of the paste is also disclosed.