发明名称 |
Photosensitive Resin Composition and Photosensitive Dry Film by the Use Thereof |
摘要 |
A photosensitive resin composition for h-ray exposure which has high sensitivity for h-ray and is excellent in resolution of a resist pattern, and a photosensitive dry film by the use thereof are provided. The photosensitive resin composition is composed of an alkali-soluble resin (A) having an alicyclic epoxy group-containing unsaturated compound in a part of a carboxyl group of a carboxyl group-containing acryl copolymer as well as having a weight-average molecular weight of 1,000 to 100,000, an ethylenically unsaturated compound (B) and a photopolymerization initiator (C) including at least a photopolymerization initiator (C1) whose absorption coefficient for light with a wavelength of 405 nm is 1 or more as an essential component.
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申请公布号 |
US2007264601(A1) |
申请公布日期 |
2007.11.15 |
申请号 |
US20050667051 |
申请日期 |
2005.10.19 |
申请人 |
TOKYO OHKA KOGYO CO., LTD |
发明人 |
UEMATSU TERUHIRO;KATSUMATA NAOYA |
分类号 |
G03F7/033;G03F7/031;G03F7/032 |
主分类号 |
G03F7/033 |
代理机构 |
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