发明名称 |
THERMAL CHUCK AND PROCESSES FOR MANUFACTURING THE THERMAL CHUCK |
摘要 |
Thermal chucks for processing semiconductor substrates include a cooling passage (106) that provides a laminar flow. The thermal chuck can be fabricated by forming the cooling passage into a selected one of a planar support surface portion (102) and an underside portion (104); sandwiching a cladding material between the planar support surface portion and the underside portion to form a thermal chuck assembly; and heating the thermal chuck assembly to a temperature and under conditions to fuse the cladding material to the planar support surface portion and the underside portion, wherein the cooling passage is sealed therein. The cooling passage can be milled or cast and has radially curved section connected to adjacent linear sections to form a serpentine-like shape. |
申请公布号 |
WO2007108961(A3) |
申请公布日期 |
2007.11.15 |
申请号 |
WO2007US06067 |
申请日期 |
2007.03.09 |
申请人 |
AXCELIS TECHNOLOGIES, INC.;LANDRIGAN, THOMAS |
发明人 |
LANDRIGAN, THOMAS |
分类号 |
B23K1/00;B23K1/008;H01L21/00 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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