INSULATING MATERIAL, PROCESS FOR PRODUCING ELECTRONIC PART/DEVICE, AND ELECTRONIC PART/DEVICE

摘要

An insulating material giving a cured object which is less apt to suffer dielectric breakdown and excellent in resistance to thermal cycling and high-temperature standing resistance; an electronic part/device; and a process for producing the part/device. The insulating material comprises a curable compound (a), a hardener (b), a high-molecular polymer having an aromatic skeleton, and an inorganic filler (e) in specific proportions, wherein the curable compound (a) is either a curable compound having two or more epoxy groups per molecule and a polycyclic aromatic hydrocarbon skeleton (a1) as at least part of the main chain or a curable compound having two or more epoxy groups per molecule and, as at least part of the main chain, a skeleton (a2) comprising two or more aromatic rings directly bonded through a single bond and the proportion of the skeleton (a1) or skeleton (a2) in all skeletons of the curable compound (a) is 30 wt.% or higher. The electronic part/device (1) has an insulating layer (4) formed from the insulating material.