摘要 |
<p>Any faults in individual layers, esp. in the visible surfaces (8) of a board (1), are detected by pref. optical scanners (2), the coordinates are fed into the memory of a control device (10), and filler is put into the faults by a filler tool (5). The control operates a milling cutter (3) or similar, to prepare the faults, which are cleaned before filling, esp. by the removal of chips. The control device also has an optimization routine, so that only faults below a set min. quality are repaired. The filler may be a piece of timber fitted into the fault, or a liquid, powder, or granulated material.</p> |