| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel resin composition capable of providing a laminate plate coping with transmission of high-frequency signals, more specifically, a resin composition combining a low dielectric constant, a low dielectric loss tangent, heat resistance and dimensional stability, and a laminate plate for high-frequency circuits using the composition. SOLUTION: The resin composition comprises (A) 100 pts.wt. of a cyclic olefinic copolymer(s), (B) 50-200 pts.wt. of a soft copolymer(s) of a glass transition temperature of≤0°C consisting of one or more of ethylene- and propylene-α-olefin copolymers, (C) 50-400 pts.wt. of an inorganic filler(s) and (D) 10-200 pts.wt. of a compound(s) containing at least one divinylbenzene type compound. A varnish, a sheet, a film and a laminate plate for high-frequency circuits obtained with the resin composition are also provided. COPYRIGHT: (C)2008,JPO&INPIT
|
