| 摘要 |
PROBLEM TO BE SOLVED: To propose a TH wiring structure which can reduce a connection resistance of upper and lower electrodes in relation to a through hole (TH) that performs connection of the upper and lower electrodes of an AL wiring cable to supply electricity to a heater in FM-BTJ, and which can reduce formation dimensions of the TH. SOLUTION: The substrate for the inkjet recording head is equipped with a plurality of heating resistors which eject ink, and a wiring cable which supplies electricity to the heating resistors. The wiring cable is formed up and down via an inter-layer insulating film 104. The wiring cable is connected by the through hole 123. A through hole configuration is constituted which at least partially includes an upper and lower electrode connection form wherein at least a part of the upper electrode in the through hole 123 that is a connection point of the upper and lower electrodes formed up and down of the inter-layer insulating film 104 is not formed on the inter-layer insulating film 104 of an outer peripheral part of the through hole 123. COPYRIGHT: (C)2008,JPO&INPIT
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