| 摘要 |
A solid-state image pickup device includes a lens-holding member and a substrate. The lens-holding member holds lenses and has a peripheral-wall shape leg located on opposite side of the lens. An image pickup device is mounted on the substrate. The substrate has a device-mounting portion where the image pickup device is mounted, and has a coupling portion that extends from the device-mounting portion and is to be coupled to an external circuit. The device-mounting portion is housed in a space surrounded by the leg. An exterior circumference of the device-mounting portion is fitted into an inner face of the leg. A cutout through which the coupling portion is extracted from the space is formed in the leg.
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