MULTI-LAYERED PROBES

摘要

A probe for a probe card assembly is provided. The probe has a post structure (202) supported by a substrate (208), a plurality of stacked beam elements (320, 522, 524) disposed on the post structure, and a tip attached (506) to a surface of a top beam element, of the plurality of stacked beam elements, that opposes the substrate. The tip is configured to be electrically connected to a semiconductor device to be tested. The probe may be bent so that the tip is further away from the substrate than the height the post structure. The effective maximum force exerted by the tips of a multi-beamed probe against, for example, DUT pads may be increased when compared to prior probes.