| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing wiring board including a built-in capacitor for improving accuracy of capacitor capacitance by reducing variation in film thickness of a dielectric material, and enabling high dielectric constant and highly sophisticated functions of the dielectric material. <P>SOLUTION: The method for manufacturing wiring board comprises the steps of (1) generating a dielectric material sheet by forming a metal foil as a first conductive layer on a single surface of the dielectric material; (2) patterning a photoresist in the dielectric material side of the dielectric material sheet; (3) forming a dielectric material pattern by patterning the dielectric material by the etching process with the formed photoresist used as a mask and then peeling the photoresist; (4) laminating the dielectric material sheet achieving contact between an insulating resin sheet and a first electrode via a semi-hardened insulating resin sheet on a wiring in the intermediate process of lamination of the wiring board, by forming the first electrode with the conductive paste bridging over the dielectric material pattern and the first conductor layer; and (5) forming a second electrode and a wiring by forming photoresist on the first conductive layer, exposing and developing the photoresist, and then etching the exposed part of the conductor. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
