发明名称 SUBSTRATE ETCHING APPARATUS, AND SUBSTRATE ETCHING METHOD USING SAME
摘要 PROBLEM TO BE SOLVED: To provide a substrate etching apparatus and a substrate etching method using the same capable of applying uniform etching to a glass substrate. SOLUTION: The substrate etching apparatus includes an etching tank, an air bubble injector, and a gas supply unit. The etching tank contains a plurality of glass substrates arranged perpendicularly to the bottom in parallel with each other. The air bubble injector injects air bubbles to the glass substrates by supporting each glass substrate inbetween. The gas supply unit is arranged outside the etching tank and supplies gas to the air bubble injector. Thus, the substrate etching apparatus uniformly injects air bubbles to the glass substrates to apply uniform etching to the glass substrates. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007300118(A) 申请公布日期 2007.11.15
申请号 JP20070119098 申请日期 2007.04.27
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 KIM KYONG MAN
分类号 H01L21/306;G02F1/13;G02F1/1333 主分类号 H01L21/306
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