发明名称 Active Filler particles in Inks
摘要 Autocatalytic plating is a form of electrode-less plating in which a metal, for example, cobalt, nickel, gold, silver or copper, is deposited onto a substrate via a chemical reduction process. Coatings derived from this process are usually more uniform and adherent than from other processes and can be applied to unusually shaped surfaces. Non-metallic surfaces can only usually be coated via this process following suitable sensitisation of the substrate. This invention therefore provides a method of preparing a substrate material for subsequent autocatalytic deposition of a metal coating reducing the need for surface preparation by using a reducible silver salt with a suitable filler in a printable ink formulation. Autocatalytic deposition may be used to coat whole surfaces or pre-determined patterns may be deposited by known printing methods.
申请公布号 US2007261595(A1) 申请公布日期 2007.11.15
申请号 US20050663819 申请日期 2005.10.06
申请人 QINETIQ LIMITED 发明人 JOHNSON DANIEL R.;WILLIS RICHARD L.;DAMERALL WILLIAM N.
分类号 C09D11/00;B05D3/10;C09D11/10;C23C18/16;C23C18/20;C23C18/31;H05K3/18 主分类号 C09D11/00
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