FLUID-CONTAINING COOLING PLATE FOR AN ELECTRONIC COMPONENT

摘要

A fluid-containing cooling plate includes a bottom plate (10), a top plate (30), and metal wire (20)or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire (30) is plated or otherwise coated with a brazeable or solderable alloy which bonds it to the plates when the assembly is heated, thereby sealing the chamber. The chamber is provided with a wicking structure and is partially filled with an evaporable fluid via an inlet (36). To make a single phase cooling plate, wire partitions serving as baffles are provided in lieu of the slugs (22).