| 摘要 |
A carrier for a double side polishing machine arranged between upper and lower lapping plates to which a polishing cloth is bonded and having a hole for holding a wafer held between the upper and lower lapping plates at the time of polishing, wherein the material of the carrier is titanium. With this, a carrier for a double side polishing machine in which the strength of the carrier is great, impurity contamination of a wafer such as a silicon wafer is suppressed, and the edge rounding at the outer circumference of the wafer can be suppressed after polishing is provided.
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