| 摘要 |
PROBLEM TO BE SOLVED: To realize an adhesive sheet that has an excellent adhesive force, unevenness followability to a wafer circuit surface, etc., prevents penetration of grinding water into a wafer circuit surface in grinding and does not cause an adhesive residue. SOLUTION: The adhesive sheet comprises a substrate and an energy ray-curable adhesive layer formed on the surface of the substrate. An energy-ray curable acrylic copolymer using a dialkyl (meth)acrylamide having high polarity and no adverse effect on a polymerization reaction, etc., as a monomer and an energy ray-curable urethane acrylate oligomer having high polarity are used in the energy ray-curable adhesive layer. Consequently, the adhesive sheet has excellent unevenness followability to a wafer circuit surface, etc., and adhesive force, prevents penetration of grinding water into a wafer circuit surface in grinding and does not cause a kerf shift and an adhesive residue. COPYRIGHT: (C)2008,JPO&INPIT |
