APPARATUS AND METHODS FOR PROCESSING, TESTING, AND PACKAGING OF SEMICONDUCTOR ICS AND IMAGE SENSORS

摘要

Enhanced optical probe structures and associated methods comprise improvements to spring structures, wherein optical signals can be transmitted through the resultant substrate by fabricating openings of sufficient size through the substrate through which the optical signals can be transmitted. The holes may be unfilled or filled with optically conducting materials including but not limited to polymers, glasses, air, vacuum, etc. Lenses, diffraction gratings and other optical elements, e.g. refractive or diffractive, can be integrated to improve the coupling efficiency or provide frequency discrimination as desired. Enhanced spring structures and associated methods are also used in conjunction with the enhanced optical probe architectures, such as for processing, testing, and/or packaging of semiconductor ICs and image sensors.