| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a relay substrate whose heat dissipation characteristic is improved by connecting module substrates and installing a heat dissipation member in an intermediate substrate, and to provide a three-dimensional electronic circuit structure using the relay substrate. <P>SOLUTION: The relay substrate is provided with an insulating housing 11 having a peripheral frame 12 in a frame shape in which one face 13 is confronted with the other face 14, and the intermediate substrate 15 which is integrally formed with the peripheral frame 12 in the middle of one face 13 and the other face 14 in an inner peripheral region of the peripheral frame 12; upper connection terminals 16 arranged on one face 13; lower connection terminals 17 disposed on the other face 14; an electronic component loading region 18 which is arranged in the intermediate substrate part 15 and in which electrodes 19 are installed; and the heat dissipation member 21 which is lower than the peripheral frame 12. The upper connection terminals 16 and the lower connection terminals 17 which are previously set are conduction-connected, and the electrodes 19 are connected to the upper connection terminals 16 or the lower connection terminals 17 which are previously set through wiring patterns. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
