发明名称 TRANSPARENT CONDUCTIVE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a plastic substrate for a display element with excellent heat resistance, chemical resistance, and a low average coefficient of linear expansion, and yet, with high transparency, and hardly being affected by warping, deformation, or crack of wiring in a thin film device forming process. SOLUTION: The transparent conductive substrate is structured by using allyl ester thermosetting resin containing a compound having a group expressed in general formula (3) as a repeating unit. In the formula, A<SP>3</SP>expresses the same meaning as that described in the detailed statement. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007299739(A) 申请公布日期 2007.11.15
申请号 JP20070086263 申请日期 2007.03.29
申请人 SHOWA DENKO KK 发明人 KADOWAKI YASUSHI;KAI KAZUFUMI
分类号 H01B5/14;G02F1/1333;H01L51/50;H05B33/02;H05B33/28 主分类号 H01B5/14
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