| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer with adehesives, laminations, and these manufacturing method for avoiding rolling-in of air bubbles between an adhesive film and a circuit surface of a semiconductor wafer to reduce non-adhered portions. SOLUTION: The manufacturing method of the semiconductor wafer with adhesives includes a step of laminating an adhesive film 10 provided with a base 1 and an adhesive layer 2 arranged on the base 1 onto a circuit surface 5a of a semiconductor wafer 5 under reduced pressure. COPYRIGHT: (C)2008,JPO&INPIT
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