| 摘要 |
A heat sink structure for embedding chips and a method for fabricating the same are proposed. An external metal layer is formed on the surface of a chip with pads and a wafer backside heat conductive layer is formed on the inactive surface of the chip. At least one chip is embedded into one cavity of a circuit board. The circuit board integrated with at lease one chip is formed with a circuit layer and a heat dissipating layer. The circuit layer is connected to the external metal layer and the heat dissipating layer is connected to the wafer backside heat conductive layer of at least one chip, so as to electrically connect to the chip embedded into the circuit board. Thus, the chip is electrically connected to outer circuit and the heat generated during operation of the chip is conducted to exit.
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