ADHESIVE SHEET, AND CONNECTING STRUCTURE FOR CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE WHICH USE THE ADHESIVE SHEET

摘要

Disclosed is an adhesive sheet which comprises a substrate material and an adhesive layer provided on the substrate material and comprising an adhesive composition, wherein the thickness (Ts) of the substrate material and the thickness (Ta) of the adhesive layer satisfy the requirement expressed by the formula (1) and the thickness (Ts) is 42 µm or less. 0.40 = Ta/Ts = 0.65 (1)