MIM CAPACITOR IN A SEMICONDUCTOR DEVICE AND METHOD THEREFOR

摘要

A MIM capacitor is formed over one or more metal interconnect layers in a semiconductor device (10). The capacitor has a lower plate electrode (36) and an upper plate electrode (40). An insulator (38) is formed between the plate electrodes. Prior to forming the first plate electrode a first insulating layer (28) is deposited over the metal of an interconnect layer. The first insulating layer (28) is planarized using a chemical mechanical polish (CMP) process. A second insulating layer (32) is then deposited over the planarized first insulating layer. The first plate electrode (36) is formed over the second insulating layer (32). An insulator (38) is formed over the first plate electrode and functions as the capacitor dielectric. A second plate electrode (40) is formed over the insulator (39). Planarizing the first insulating layer and depositing a second insulating layer over the first insulating layer, reduces defects and produces a more reliable capacitor.