发明名称 LIGHT-EMITTING DEVICE AND ITS MANUFACTURING METHOD, AND ELECTRONIC INSTRUMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To homogenize the thickness of a light emitting layer when a light emitting device is manufactured by forming the light emitting layer by applying a material. <P>SOLUTION: A light emitting device 10 is provided. The light emitting device 10 has a light transparent substrate 11; a disc-like light emitting element 12 which comprises a part of a light emitting layer 22 formed on the substrate 11, and emits light upon receiving the supply of a current; and a light screening structure (power supply wiring SL) which positions between the substrate 11 and the light emitting layer 22, and encircles the light emitting element 12 without overlapping the light emitting element 12 viewed from a direction vertical to the substrate 11. A part or the entire of an end of the light emitting element 12 side of the structure is curved along the circumferential end of the light emitting element 12 in a view from the vertical direction with respect to the substrate 11. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007299978(A) 申请公布日期 2007.11.15
申请号 JP20060127418 申请日期 2006.05.01
申请人 SEIKO EPSON CORP 发明人 MIYAO TOSHIAKI;FUJIKAWA SHINSUKE;JO HIROAKI
分类号 H01L51/50;B41J2/44;B41J2/45;B41J2/455;H05B33/10 主分类号 H01L51/50
代理机构 代理人
主权项
地址