| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the yield of a light emitting device which has a plurality of light emitting elements on a surface of a substrate. <P>SOLUTION: The light emitting device H has a plurality of unit sections U (U1, U2) which are arranged side by side in an X direction. Each of the unit sections U is formed of a substrate 10 which is different from each other, the plurality of light emitting elements E arranged on the surface of the substrate along the X direction, and IC chips 15 for driving the light emitting elements of the corresponding unit section U. The unit sections U are secured to a single support body 20 which is opposed to the substrates 10 in a manner pinching the light emitting elements E of the unit sections U. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
