| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is superior in heat dissipation enough to solve a problem that insufficient heat dissipation of a semiconductor chip causes an increase in channel temperature and degradation of electric characteristic and results in malfunction. SOLUTION: The semiconductor device is provided with a ceramic package 20 which is provided with a ceramic box 22 having a chip mounting pad 23a, and a semiconductor chip 28 mounted to the chip mounting pad; a plate base 30 provided with a groove 34 on its one surface (rear face) 30b; a heat dissipation body 50 having a mounting surface 50a to which the base is mounted; and a silicon grease film 40 wherein the groove is embedded between the mounting surface of the heat dissipation body and one surface of the base. COPYRIGHT: (C)2008,JPO&INPIT |
