| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible wiring board which is, especially, superior in adhesion property between a base film and metal wiring, superior in the reliability of a flex life and a thin constitution, etc., and copes with the high-densification of wiring, related to a wiring board used in fields of electric apparatuses, electronic apparatuses and communication, etc. SOLUTION: This flexible wiring board comprises a base substrate layer having a porous structure, a metal wiring layer formed on one side surface of the base substrate layer, and a metal wiring protective layer. In the flexible wiring board, the base substrate layer is filled with at least a part of the metal wiring layer, and a layer filled with an inorganic filler containing the inorganic filler at a ratio at least higher than the metal wiring layer side is formed on the opposite side to the metal wiring layer of the base substrate layer. By employing such a structure, superior folding resistance and flexibility can be obtained, and the ultrathin flexible wiring board of high reliability is provided at a low cost with structure where high-density wiring is formed. COPYRIGHT: (C)2008,JPO&INPIT
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