发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device comprising a channel part having a satisfactory carrier mobility, and to provide its manufacturing method. SOLUTION: The semiconductor device comprises a protruding first conductive type first semiconductor layer 13 formed on an insulating layer 12 of a substrate 14; a gate electrode 17 formed on a first side surface of the layer 13 and a second side surface facing to the first side surface through gate insulating films 16a, 16b; a source region 19 having second conductive type second semiconductor layers 18a, 18b different from the layer 13 formed from the part on the layer 12 of the substrate 14 on the third side surface of the layer 13, and a drain region 20 having the second conductive type second semiconductor layers 18c, 18d different from the layer 13 formed from the part on the layer 12 of the substrate 14 on the fourth side surface facing to the third side surface of the layer 13. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007299951(A) 申请公布日期 2007.11.15
申请号 JP20060126965 申请日期 2006.04.28
申请人 TOSHIBA CORP 发明人 NISHIYAMA NOBUYASU;YAHASHI KATSUNORI
分类号 H01L29/786;H01L21/336;H01L29/78 主分类号 H01L29/786
代理机构 代理人
主权项
地址
您可能感兴趣的专利