| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method for inspecting a semiconductor capable of decreasing a damage as much as possible on the surface of a bonding pad. SOLUTION: The semiconductor inspecting device of a semiconductor element 40 having a plurality of bonding pads 45 comprises a probe card 10 having a measurement terminal 12 for electrically connecting with the pads 45, a conductive material liquid supply nozzle 14 for supplying the conductive material liquid 50 on the pads 45 or to an end part of the terminal 12, and a measurement controller 20 for electrically connecting the end part of the terminal 12 to the pads 45 through the liquid 50 to inspect the characteristic of the semiconductor element 40. COPYRIGHT: (C)2008,JPO&INPIT
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