| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a wiring, particularly, corresponding to fine wiring by improving reliability of wiring. SOLUTION: A photoresist film 7 is formed on a substrate 1, exposed and developed. Accordingly, a groove 9 is formed with a second groove 9B having width W2 and depth D2, and a first groove 9A located almost at the center of the second groove 9B and having width W1 and depth D1. A conductive film (wiring) is formed within the first groove 9A by injecting, for example, a conductive material liquid to the first groove 9A with the ink jet method, and then conducting the heat treatment thereto. COPYRIGHT: (C)2008,JPO&INPIT
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