发明名称 GRINDING WHEEL
摘要 PROBLEM TO BE SOLVED: To provide a grinding wheel which grinding a grinding surface of a workpiece such as a wafer without damaging it when grinding, while supplying grinding water to the grinding surface. SOLUTION: Instead of a segment-like grinding wheel, an annular grinding wheel 41 is fixed to a wheel base 43. By radially forming a discharge groove 48 discharging the grinding water to a fixing part 42 fixing the annular grinding wheel 41, the grinding surface of the workpiece is ground without damaging it by a chipped grinding wheel broken piece like the segment-like grinding wheel. Since the grinding water dammed up inside the annular grinding wheel 41 flows out to an external part from the discharge groove 48 radially formed so as to cross with the annular grinding wheel 41, the inside and the outside of the annular grinding wheel 41 are filled with the grinding water, and the annular grinding wheel 41 is sufficiently cooled, and inside grinding chips are discharged. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007296601(A) 申请公布日期 2007.11.15
申请号 JP20060125761 申请日期 2006.04.28
申请人 DISCO ABRASIVE SYST LTD 发明人 SEKIYA MINOSUKE;YAMAMOTO SETSUO
分类号 B24B55/02;B24D3/06;B24D3/14;B24D3/28 主分类号 B24B55/02
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