发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in moist heat resistance and capable of forming a transparent cured material, to provide an optical film prepared by curing the thermosetting resin composition, and to provide a laminated film prepared by applying the thermosetting resin composition on a base film and curing the same. SOLUTION: The thermosetting resin composition comprises (A) a polycarboxylic acid resin, and (B) an epoxy resin and/or an oxetane resin as essential components, and the transmittance of a film of ca. 80μm thickness obtained by curing the thermosetting resin composition is at least 90% in the whole wave length range of 380-750 nm. The optical film is obtained by curing the thermosetting resin composition, and the laminated film is obtained by applying the thermosetting resin composition on a base film, followed by curing the same. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007297604(A) 申请公布日期 2007.11.15
申请号 JP20070087736 申请日期 2007.03.29
申请人 SHOWA DENKO KK 发明人 UCHIDA HIROSHI;SAKATA YUKO
分类号 C08G59/42;C08J5/18;C08L71/02;C08L75/04;G02B1/04;G02B5/30 主分类号 C08G59/42
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