| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave element chip capable of securing reliability for a long time cost-effectively and to provide a surface acoustic wave device mounted with the surface acoustic wave element chip. SOLUTION: The surface acoustic wave element chip 10 to solve the task above provided with an exciting electrode 14 located on one principal side of a piezoelectric substrate 12 is characterized in adopting a raw substrate of the class C or below stipulated in the JIS standards for the raw substrate for manufacturing the piezoelectric substrate 12 to suppress a displacement of vibration excited on the surface of the piezoelectric substrate 12 within a range which the exciting electrode 14 withstands. In the surface acoustic wave element chip 10 with a configuration as above, the piezoelectric substrate 12 may be cut at a cut angle whereby SH waves can be excited. Further, the surface acoustic wave device may be mounted with the surface acoustic wave element chip with the configuration above. COPYRIGHT: (C)2008,JPO&INPIT
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