| 摘要 |
PROBLEM TO BE SOLVED: To aim at a tact improvement by reducing the heating period of time and an excessive heating, and to reduce a thermal shock to a product in order to solve the problems that when a flexible wiring board is thermally bent and bonded, by a conventional criterion plate being made of a material having a good thermal conductivity other than a resin, the heat is taken away by the criterion plate, and the heat is not efficiently transmitted to a heat curing adhesive, and therefore, the heating period of time and a heating temperature at the time of the heat curing have to be applied more than required. SOLUTION: When a flexible wiring board is bent and thermally bond-fixed in this inkjet printing head having the criterion plate being constituted of a material other than resins, a resin layer of a low thermal conductivity is provided at a bent section to efficiently transmit heat to the heat-curing adhesive to perform the process in a short period of time and suppress a thermal effect to other parts to a minimum. COPYRIGHT: (C)2008,JPO&INPIT
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