| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in the toughness after curing. SOLUTION: The thermosetting resin composition comprises a thermosetting resin, a curing agent, a polyethersulfone and a polyetherimide, wherein the content of the polyethersulfone is 30-70 pts.mass based on 100 pts.mass of the thermoset resin, and the content of the polyetherimide is 1-10 pts.mass based on 100 pts.mass of the thermosetting resin. In addition, the thermosetting resin composition comprises a thermosetting resin, a curing agent, a polyethersulfone, and a polyetherimide, the thermosetting resin and the polyethersulfone form a bicontinuous phase, and a cured material having a micro phase separation structure in which the polyetherimide forms a domain in the bicontinuous phase is formed. COPYRIGHT: (C)2008,JPO&INPIT
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