SYSTEMS AND METHODS FOR HIGH DENSITY MULTI-COMPONENT MODULES
摘要
A method for forming a device, comprising providing a first substrate carrying a first set of components disposed in a first encapsulating layer over the first set of components, providing a second substrate carrying a second set of components disposed in a second encapsulating layer over the second set of components, bonding the first and second substrates and functionally interconnecting at least one of the predefined components in the first set of components with at least one of the components in the second set of components.
申请公布号
WO2007130471(A2)
申请公布日期
2007.11.15
申请号
WO2007US10659
申请日期
2007.05.01
申请人
THE CHARLES STARK DRAPER LABORATORY, INC.;UHLAND, SCOTT, A.;DAVIS, SETH, M.;SHANFIELD, STANLEY, R.;WHITE, DOUGLAS, W.;RACZ, LIVIA, M.