RESIN COMPRESSION MOLDING SYSTEM FOR SEMICONDUCTOR DEVICE AND METHOD FOR MOLDING SEMICONDUCTOR DEVICE WITH RESIN USING THE SAME

摘要

A resin compression molding system for a semiconductor device and a method for molding the semiconductor device are provided to mold a plurality of products simultaneously or sequentially by controlling the number of molding blocks or molds. A resin compression molding system for a semiconductor device includes a material supply block, a molding block, and an inspection/ejection block. The material supply block transfers a frame in a length direction and measures a thickness of the semiconductor device. The material supply block rotates the frame by 90 degrees and delivers the frame in a width direction. The molding block is removably arranged on the material supply block and places the frame on a mold. The frame is molded. The inspection/ejection block is removably arranged on the molding block and inspects the molded frame. The inspection/ejection block rotates the frame by 90 degrees and ejects the frame in the length direction.