| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin/miniaturized optical device and an optical device module, excellent in manufacturing yield and optical characteristics while being light in weight. <P>SOLUTION: The optical device module is constituted of an optical element (LED element and semiconductor imaging element) equipped with a light receiving/emitting region, a peripheral circuit region, and an electrode region; a transparent member whose light receiving/emitting region is larger than the optical element, and which is provided on one side surface thereof with a projected electrode for connecting the same to the electrode of the optical element (LED element and the semiconductor imaging element), an electrode for external connection for connecting to a mounting substrate, and a conductor wiring for connection between the projected electrode and the electrode for external connection; and transparent adhesive provided between the optical element (LED element and semiconductor imaging element) and the transparent member. In this case, the surface with the light receiving/emitting region of the optical element (LED element and semiconductor imaging element) formed thereon and one side of the transparent member are opposed to connect electrically the electrode of the optical element (LED element and semiconductor imaging element) to the projected electrode of the transparent member through the transparent adhesive and, also, bond the optical element to the transparent member. <P>COPYRIGHT: (C)2008,JPO&INPIT |
