| 摘要 |
A method for manufacturing a stacked bump structure including the following steps is provided. First, a substrate having multiple bonding pads disposed on a surface thereof is provided. Next, a first bump and a second bump are respectively formed on any two adjacent bonding pads of the substrate. Then, a third bump is formed between the first bump and the second bump by wire bonding technology, so as to make the two adjacent bonding pads electrically connected to each other through the third bump.
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