摘要 |
A semiconductor system (300) has one or more packaged active subsystems (310, 330); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on top of each other, assembled on the substrate. The system further has a packaged passive subsystem (320) including a substrate with electrical contacts and passive electrical components, such as resistors, capacitors, and indictors. The passive subsystem is stacked with the active subsystems and connected to them by solder bodies. |
申请人 |
TEXAS INSTRUMENTS INCORPORATED;GERBER, MARK, A.;WACHTLER, KURT, P.;CASTRO, ABRAM, M. |
发明人 |
GERBER, MARK, A.;WACHTLER, KURT, P.;CASTRO, ABRAM, M. |