Exposure device for wafer dividing system, has transferring unit for transferring wafer from grinding unit to plasma etching system, where transferring unit removes appropriate section of resist layer

摘要

The device (3) has a transferring unit (4) for transferring a wafer from a grinding unit (2) to a plasma etching system. A resist covering unit (32) is provided for covering a rear side of the wafer using a resist layer. A drying unit (33) is provided for drying the resist layer. An exposure unit (34) for exposing the resist layer in order to remove the section of the resist layer. A developer unit (35) is provided for supplying a developer liquid of the resist layer and for removing a part of the resist layer. The transferring unit removes the appropriate section of the resist layer.