| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting board wherein soldering failure is prevented, as well as a method of manufacturing the same. SOLUTION: The electronic component mounting board 1 is provided with a base substrate 15 made of an insulator, a first pattern 3 which is formed on one surface of the base substrate 15 and is formed of a conductive layer, a land 5 which is provided in the first pattern 3 and is coated with a solder, and a second pattern 5 which is formed on the other surface of the base substrate 15 and is formed of a conductive layer. A through-hole 6 penetrates the first and second patterns 3 and 5 therein. A plurality of through-holes 6 are made outside the land 5. COPYRIGHT: (C)2008,JPO&INPIT
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