| 摘要 |
A semiconductor device of the present invention includes a first semiconductor chip, a second semiconductor chip, and an adhesive layer, sandwiched between the first and second semiconductor chips, which adheres to the first semiconductor chip 2 , the first and second semiconductor chips being laminated so that part of the second semiconductor chip protrudes outwards from an outer edge of the first semiconductor chip, the adhesive layer adhering to the first semiconductor chip so as to avoid an outer edge of the first semiconductor chip from which outer edge portion the part of the second semiconductor chip protrudes outwards. This makes it possible to provide a semiconductor device having a highly reliable (durable) laminated structure in which semiconductor chips are laminated.
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