MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

摘要

A method of manufacturing a printed circuit board is provided to adjust a thickness of an insulation layer by using a clamp and a thickness adjusting roll. An inner layer substrate(10) having a via-hole is provided. The via-hole is filled with an insulation material. The inner layer substrate is arranged on a circulating liquid resin(50), so that the liquid resin is filled from a lower portion to an upper portion of the via-hole. The liquid resin is circulated by using an ultrasonic wave. The liquid resin is heated by a heater(36). The insulation layer is formed by using the circulating liquid resin.