| 摘要 |
PROBLEM TO BE SOLVED: To provide manufacturing method of a printed wiring board, which can improve connecting reliability when an electronic part of a semiconductor package or the like is mounted. SOLUTION: A plurality of bumps 2 comprising conducting parts are formed on a sheet-shaped conducting supporting body. A synthetic-resin based sheet 3 is laminated and compressed on the conducting supporting body, wherein the bump 2 is compressed. The tip of the bump 2 is penetrated through the synthetic-resin sheet 3 and exposed. A first conductor layer 5 is laminated in the synthetic-resin based sheet 3 and compressed, and the tip of the bump 2 is pressed on the conductor layer 5. A penetrating type conductor wiring part is formed by the bump 2. At least a part of the conducting supporting body is released, and a part of a base part 2a of the base 2 is exposed. Plating is performed on the side, where the bump is exposed, and a second conductor layer 14 is formed. Etching is performed on the conducting supporting body, and a wiring pattern 12 is connected to the penetration type conductor wiring part. The wiring pattern 12 is connected to the bump 2 through the conductor layer 14. |
