| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a proportional groove form by appropriately selecting a machining method corresponding to physical property of a machined material and removing chips without electrostatic adhesion, in a striating machine for providing concentric or gridded striations by machining in a pad for use in a semiconductor CMP processing. Ž<P>SOLUTION: The striating machine has a circular table 1 for adhering and fixing with a urethane foam pad and C-axis-controlled about a vertical axis, a gantry column 11 straddling the circular table and X-axis-controlled, saddles movable along the Y-axis on the gantry column, tool rests 18 and 19 Z-axis-controlled on the saddles, and a fixed tool (turning, cutting) and a rotary tool unit (milling cutter, drill) capable of a tool change on the tool rests. Jets from an ion blow nozzle arranged near the tool neutralize, in machining, the static electricity of the pad and chips to facilitate chip evacuation. Ž<P>COPYRIGHT: (C)2004,JPO Ž |
